Moishe Groger, Shadi M. Harb, Devin Morris, William R. Eisenstadt, Sudeep Puligundla. High speed I/O and thermal effect characterization of 3D stacked ICs. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-5, IEEE, 2009. [doi]
Abstract is missing.