Thermal-Aware Fixed-Outline 3-D IC Floorplanning: An End-to-End Learning-Based Approach

Wenbo Guan, XiaoYan Tang, Hongliang Lu, YuMing Zhang, YiMen Zhang. Thermal-Aware Fixed-Outline 3-D IC Floorplanning: An End-to-End Learning-Based Approach. IEEE Trans. VLSI Syst., 31(12):1882-1895, December 2023. [doi]

Abstract

Abstract is missing.