Menghan Guo, Shoushun Chen, Zhe Gao, Wenlei Yang, Peter Bartkovjak, Qing Qin, Xiaoqin Hu, Dahai Zhou, Qiping Huang, Masayuki Uchiyama, Yoshiharu Kudo, Shimpei Fukuoka, Chengcheng Xu, Hiroaki Ebihara, Xueqing Wang, Peiwen Jiang, Bo Jiang, Bo Mu, Huan Chen, Jason Yang, TJ Dai, Andreas Suess. A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1-MPixel EVS With 4.6-GEvent/s Readout, In-Pixel TDC, and On-Chip ISP and ESP Function. J. Solid-State Circuits, 58(11):2955-2964, November 2023. [doi]
Abstract is missing.