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In-Situ Ultrasonic Inspection of Thickness and Morphology of Thermal Interface Material in Multilayer Structure Using Modified Minimum Entropy Deconvolution

Shifeng Guo, Yangyang Huang, Dan Chen, Linlin Ren, Dawei Wang, Wei Feng. In-Situ Ultrasonic Inspection of Thickness and Morphology of Thermal Interface Material in Multilayer Structure Using Modified Minimum Entropy Deconvolution. IEEE T. Instrumentation and Measurement, 71:1-10, 2022. [doi]

Authors

Shifeng Guo

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Yangyang Huang

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Dan Chen

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Linlin Ren

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Dawei Wang

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Wei Feng

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