Shifeng Guo, Yangyang Huang, Dan Chen, Linlin Ren, Dawei Wang, Wei Feng. In-Situ Ultrasonic Inspection of Thickness and Morphology of Thermal Interface Material in Multilayer Structure Using Modified Minimum Entropy Deconvolution. IEEE T. Instrumentation and Measurement, 71:1-10, 2022. [doi]
@article{GuoHCRWF22,
title = {In-Situ Ultrasonic Inspection of Thickness and Morphology of Thermal Interface Material in Multilayer Structure Using Modified Minimum Entropy Deconvolution},
author = {Shifeng Guo and Yangyang Huang and Dan Chen and Linlin Ren and Dawei Wang and Wei Feng},
year = {2022},
doi = {10.1109/TIM.2022.3210962},
url = {https://doi.org/10.1109/TIM.2022.3210962},
researchr = {https://researchr.org/publication/GuoHCRWF22},
cites = {0},
citedby = {0},
journal = {IEEE T. Instrumentation and Measurement},
volume = {71},
pages = {1-10},
}