Shifeng Guo, Yangyang Huang, Dan Chen, Linlin Ren, Dawei Wang, Wei Feng. In-Situ Ultrasonic Inspection of Thickness and Morphology of Thermal Interface Material in Multilayer Structure Using Modified Minimum Entropy Deconvolution. IEEE T. Instrumentation and Measurement, 71:1-10, 2022. [doi]
Abstract is missing.