W. Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, M. Gonzalez, Yann Civale, A. Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, K. J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen. 3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. In IEEE International Conference on IC Design & Technology, ICICDT 2012, Austin, TX, USA, May 30 - June 1, 2012. pages 1-4, IEEE, 2012. [doi]
@inproceedings{GuoPIECWMGCRBJV12,
title = {3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps},
author = {W. Guo and Geert Van der Plas and Andrej Ivankovic and Geert Eneman and Vladimir Cherman and Bart De Wachter and Abdelkarim Mercha and M. Gonzalez and Yann Civale and A. Redolfi and Thibault Buisson and A. Jourdan and Bart Vandevelde and K. J. Rebibis and Ingrid De Wolf and Antonio La Manna and Gerald Beyer and Eric Beyne and Bart Swinnen},
year = {2012},
doi = {10.1109/ICICDT.2012.6232855},
url = {http://dx.doi.org/10.1109/ICICDT.2012.6232855},
researchr = {https://researchr.org/publication/GuoPIECWMGCRBJV12},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE International Conference on IC Design & Technology, ICICDT 2012, Austin, TX, USA, May 30 - June 1, 2012},
publisher = {IEEE},
isbn = {978-1-4673-0146-6},
}