Interface delamination analysis of TQFP package during solder reflow

Hu Guojun, Roberto Rossi, Jing-en Luan, Xavier Baraton. Interface delamination analysis of TQFP package during solder reflow. Microelectronics Reliability, 50(7):1014-1020, 2010. [doi]

Authors

Hu Guojun

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Roberto Rossi

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Jing-en Luan

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Xavier Baraton

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