Hu Guojun, Roberto Rossi, Jing-en Luan, Xavier Baraton. Interface delamination analysis of TQFP package during solder reflow. Microelectronics Reliability, 50(7):1014-1020, 2010. [doi]
@article{GuojunRLB10,
title = {Interface delamination analysis of TQFP package during solder reflow},
author = {Hu Guojun and Roberto Rossi and Jing-en Luan and Xavier Baraton},
year = {2010},
doi = {10.1016/j.microrel.2010.03.012},
url = {http://dx.doi.org/10.1016/j.microrel.2010.03.012},
tags = {analysis},
researchr = {https://researchr.org/publication/GuojunRLB10},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {50},
number = {7},
pages = {1014-1020},
}