Shubhanshu Gupta, Joycee Mekie. Soft Error Resilient and Energy Efficient Dual Modular TSPC Flip-Flop. In 32nd International Conference on VLSI Design and 2019 18th International Conference on Embedded Systems, VLSID 2019, Delhi, India, January 5-9, 2019. pages 341-346, IEEE, 2019. [doi]
Abstract is missing.