Koutaro Hachiya, Atsushi Kurokawa. Testing Through Silicon Vias in Power Distribution Network of 3D-IC with Manufacturing Variability Cancellation. In 2020 Design, Automation & Test in Europe Conference & Exhibition, DATE 2020, Grenoble, France, March 9-13, 2020. pages 290-293, IEEE, 2020. [doi]
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