Koji Hamaguchi, Mitsuki Nakata, Kouta Segawa, Naoya Suzuki, Toshihisa Nonaka. Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-6, IEEE, 2019. [doi]
@inproceedings{HamaguchiNSSN19,
title = {Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package},
author = {Koji Hamaguchi and Mitsuki Nakata and Kouta Segawa and Naoya Suzuki and Toshihisa Nonaka},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058902},
url = {https://doi.org/10.1109/3DIC48104.2019.9058902},
researchr = {https://researchr.org/publication/HamaguchiNSSN19},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}