M. Hamid, K. O'Connell, J. Bielick, J. Bennett, E. Campbell, A. Alfoqaha. Numerical Simulation and Characterization of PCB Warpage. In IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022. pages 16-1, IEEE, 2022. [doi]
@inproceedings{HamidOBBCA22,
title = {Numerical Simulation and Characterization of PCB Warpage},
author = {M. Hamid and K. O'Connell and J. Bielick and J. Bennett and E. Campbell and A. Alfoqaha},
year = {2022},
doi = {10.1109/IRPS48227.2022.9764416},
url = {https://doi.org/10.1109/IRPS48227.2022.9764416},
researchr = {https://researchr.org/publication/HamidOBBCA22},
cites = {0},
citedby = {0},
pages = {16},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022},
publisher = {IEEE},
isbn = {978-1-6654-7950-9},
}