M. Hamid, K. O'Connell, J. Bielick, J. Bennett, E. Campbell, A. Alfoqaha. Numerical Simulation and Characterization of PCB Warpage. In IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022. pages 16-1, IEEE, 2022. [doi]
Abstract is missing.