Donghyun Han, Hayoung Lee, Donghyun Kim, Sungho Kang. A new repair scheme for TSV-based 3D memory using base die repair cells. In International SoC Design Conference, ISOCC 2017, Seoul, Korea (South), November 5-8, 2017. pages 11-12, IEEE, 2017. [doi]
Abstract is missing.