Signal Integrity in High Speed 3D IC Design- A Case Study

Shadi M. Harb, William R. Eisenstadt. Signal Integrity in High Speed 3D IC Design- A Case Study. In Jari Nurmi, Dag T. Wisland, Snorre Aunet, Kristian Kjelgaard, editors, IEEE Nordic Circuits and Systems Conference, NorCAS 2021, Oslo, Norway, October 26-27, 2021. pages 1-5, IEEE, 2021. [doi]

Abstract

Abstract is missing.