Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages - researchr publication authors

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T. Robert Harris, W. Rhett Davis, Steven Lipa, W. Shepherd Pitts, Paul D. Franzon. Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-3, IEEE, 2019. [doi]

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