T. Robert Harris, W. Rhett Davis, Steven Lipa, W. Shepherd Pitts, Paul D. Franzon. Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-3, IEEE, 2019. [doi]
@inproceedings{HarrisDLPF19,
title = {Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages},
author = {T. Robert Harris and W. Rhett Davis and Steven Lipa and W. Shepherd Pitts and Paul D. Franzon},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058784},
url = {https://doi.org/10.1109/3DIC48104.2019.9058784},
researchr = {https://researchr.org/publication/HarrisDLPF19},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}