T. Robert Harris, Paul D. Franzon, W. Rhett Davis, Lee Wang. Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-3, IEEE, 2014. [doi]
Abstract is missing.