Masaki Hashizume, Tomoaki Konishi, Hiroyuki Yotsuyanagi, Shyue-Kung Lu. Testable Design for Electrical Testing of Open Defects at Interconnects in 3D ICs. In 22nd Asian Test Symposium, ATS 2013, Yilan County, Taiwan, November 18-21, 2013. pages 13-18, IEEE, 2013. [doi]
Abstract is missing.