Signal through-the-silicon via planning and pin assignment for thermal and wire length optimization in 3D ICs

Xu He, Sheqin Dong, Yuchun Ma. Signal through-the-silicon via planning and pin assignment for thermal and wire length optimization in 3D ICs. Integration, 43(4):342-352, 2010. [doi]

Authors

Xu He

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Sheqin Dong

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Yuchun Ma

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