Xu He, Sheqin Dong, Yuchun Ma. Signal through-the-silicon via planning and pin assignment for thermal and wire length optimization in 3D ICs. Integration, 43(4):342-352, 2010. [doi]
@article{HeDM10,
title = {Signal through-the-silicon via planning and pin assignment for thermal and wire length optimization in 3D ICs},
author = {Xu He and Sheqin Dong and Yuchun Ma},
year = {2010},
doi = {10.1016/j.vlsi.2010.06.001},
url = {http://dx.doi.org/10.1016/j.vlsi.2010.06.001},
tags = {optimization},
researchr = {https://researchr.org/publication/HeDM10},
cites = {0},
citedby = {0},
journal = {Integration},
volume = {43},
number = {4},
pages = {342-352},
}