Wafer Level Stress: Enabling Zero Defect Quality for Automotive Microcontrollers without Package Burn-In

Chen He, Yanyao Yu. Wafer Level Stress: Enabling Zero Defect Quality for Automotive Microcontrollers without Package Burn-In. In IEEE International Test Conference, ITC 2020, Washington, DC, USA, November 1-6, 2020. pages 1-10, IEEE, 2020. [doi]

Abstract

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