Thin wafer handling - Study of temporary wafer bonding materials and processes - researchr publication bibliographies

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James Hermanowski. Thin wafer handling - Study of temporary wafer bonding materials and processes. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-5, IEEE, 2009. [doi]

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