James Hermanowski. Thin wafer handling - Study of temporary wafer bonding materials and processes. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-5, IEEE, 2009. [doi]
@inproceedings{Hermanowski09,
title = {Thin wafer handling - Study of temporary wafer bonding materials and processes},
author = {James Hermanowski},
year = {2009},
doi = {10.1109/3DIC.2009.5306550},
url = {http://dx.doi.org/10.1109/3DIC.2009.5306550},
researchr = {https://researchr.org/publication/Hermanowski09},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009},
publisher = {IEEE},
}