Ron Ho, Ken Mai, Hema Kapadia, Mark Horowitz. Interconnect scaling implications for CAD. In Jacob K. White, Ellen Sentovich, editors, Proceedings of the 1999 IEEE/ACM International Conference on Computer-Aided Design, 1999, San Jose, California, USA, November 7-11, 1999. pages 425-429, IEEE, 1999. [doi]
Abstract is missing.