A highly-dense mixed grained reconfigurable architecture with overlay crossbar interconnect using via-switch

Junshi Hotate, Takashi Kishimoto, Toshiki Higashi, Hiroyuki Ochi, Ryutaro Doi, Munehiro Tada, Tadahiko Sugibayashi, Kazutoshi Wakabayashi, Hidetoshi Onodera, Yukio Mitsuyama, Masanori Hashimoto. A highly-dense mixed grained reconfigurable architecture with overlay crossbar interconnect using via-switch. In Paolo Ienne, Walid A. Najjar, Jason Anderson, Philip Brisk, Walter Stechele, editors, 26th International Conference on Field Programmable Logic and Applications, FPL 2016, Lausanne, Switzerland, August 29 - September 2, 2016. pages 1-4, IEEE, 2016. [doi]

Abstract

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