Cliff Hou. Physical Design for 3D Chiplets and System Integration. In William Swartz, Jens Lienig, editors, ISPD 2020: International Symposium on Physical Design, Taipei, Taiwan, March 29 - April 1, 2020, delayed to September 20-23, 2020. pages 73, ACM, 2020. [doi]
Abstract is missing.