Lin Hou, Emmanuel Chery, Kristof Croes, Davide Tierno, Soon Aik Chew, Yangyin Chen, Peter Rakbin, Eric Beyne. Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism. In IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022. pages 4, IEEE, 2022. [doi]
@inproceedings{HouCCTCCRB22,
title = {Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism},
author = {Lin Hou and Emmanuel Chery and Kristof Croes and Davide Tierno and Soon Aik Chew and Yangyin Chen and Peter Rakbin and Eric Beyne},
year = {2022},
doi = {10.1109/IRPS48227.2022.9764478},
url = {https://doi.org/10.1109/IRPS48227.2022.9764478},
researchr = {https://researchr.org/publication/HouCCTCCRB22},
cites = {0},
citedby = {0},
pages = {4},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022},
publisher = {IEEE},
isbn = {978-1-6654-7950-9},
}