TSV redundancy: Architecture and design issues in 3D IC - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Ang-Chih Hsieh, TingTing Hwang, Ming-Tung Chang, Min-Hsiu Tsai, Chih-Mou Tseng, Hung-Chun Li. TSV redundancy: Architecture and design issues in 3D IC. In Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010. pages 166-171, IEEE, 2010. [doi]

This author has not been identified. Look up 'Ang-Chih Hsieh' in GoogleThis author has not been identified. Look up 'TingTing Hwang' in GoogleThis author has not been identified. Look up 'Ming-Tung Chang' in GoogleThis author has not been identified. Look up 'Min-Hsiu Tsai' in GoogleThis author has not been identified. Look up 'Chih-Mou Tseng' in GoogleThis author has not been identified. Look up 'Hung-Chun Li' in Google

runs on WebDSL