Ang-Chih Hsieh, TingTing Hwang, Ming-Tung Chang, Min-Hsiu Tsai, Chih-Mou Tseng, Hung-Chun Li. TSV redundancy: Architecture and design issues in 3D IC. In Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010. pages 166-171, IEEE, 2010. [doi]
@inproceedings{HsiehHCTTL10,
title = {TSV redundancy: Architecture and design issues in 3D IC},
author = {Ang-Chih Hsieh and TingTing Hwang and Ming-Tung Chang and Min-Hsiu Tsai and Chih-Mou Tseng and Hung-Chun Li},
year = {2010},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5457218},
tags = {redundancy, architecture, design},
researchr = {https://researchr.org/publication/HsiehHCTTL10},
cites = {0},
citedby = {0},
pages = {166-171},
booktitle = {Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010},
publisher = {IEEE},
}