Meng-Kai Hsu, Valeriy Balabanov, Yao-Wen Chang. TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel Weighted-Average Wirelength Model. IEEE Trans. on CAD of Integrated Circuits and Systems, 32(4):497-509, 2013. [doi]
@article{HsuBC13,
title = {TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel Weighted-Average Wirelength Model},
author = {Meng-Kai Hsu and Valeriy Balabanov and Yao-Wen Chang},
year = {2013},
doi = {10.1109/TCAD.2012.2226584},
url = {http://dx.doi.org/10.1109/TCAD.2012.2226584},
researchr = {https://researchr.org/publication/HsuBC13},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {32},
number = {4},
pages = {497-509},
}