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Meng-Kai Hsu, Valeriy Balabanov, Yao-Wen Chang. TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel Weighted-Average Wirelength Model. IEEE Trans. on CAD of Integrated Circuits and Systems, 32(4):497-509, 2013. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: TSV-aware analytical placement for 3D IC designsMeng-Kai Hsu, Yao-Wen Chang, Valeriy Balabanov. dac 2011: 664-669 [doi] BiG: A Bivariate Gradient-Based Wirelength Model for Analytical Circuit PlacementFan-Keng Sun, Yao-Wen Chang. dac 2019: 118 [doi]
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