Po-Yang Hsu, Hsien-Te Chen, TingTing Hwang. Stacking signal TSV for thermal dissipation in global routing for 3D IC. In 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, January 22-25, 2013. pages 699-704, IEEE, 2013. [doi]
Abstract is missing.