Stacking Signal TSV for Thermal Dissipation in Global Routing for 3-D IC

Po-Yang Hsu, Hsien-Te Chen, TingTing Hwang. Stacking Signal TSV for Thermal Dissipation in Global Routing for 3-D IC. IEEE Trans. on CAD of Integrated Circuits and Systems, 33(7):1031-1042, 2014. [doi]

Abstract

Abstract is missing.