Reliability consideration with rectangle- and double-signal through silicon vias insertion in 3D thermal-aware floorplanning - researchr publication authors

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Chih-han Hsu, Shanq-Jang Ruan, Ying-Jung Chen, Tsang-Chi Kan. Reliability consideration with rectangle- and double-signal through silicon vias insertion in 3D thermal-aware floorplanning. In International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013. pages 316-321, IEEE, 2013. [doi]

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