Chih-han Hsu, Shanq-Jang Ruan, Ying-Jung Chen, Tsang-Chi Kan. Reliability consideration with rectangle- and double-signal through silicon vias insertion in 3D thermal-aware floorplanning. In International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013. pages 316-321, IEEE, 2013. [doi]
@inproceedings{HsuRCK13, title = {Reliability consideration with rectangle- and double-signal through silicon vias insertion in 3D thermal-aware floorplanning}, author = {Chih-han Hsu and Shanq-Jang Ruan and Ying-Jung Chen and Tsang-Chi Kan}, year = {2013}, doi = {10.1109/ISQED.2013.6523628}, url = {http://dx.doi.org/10.1109/ISQED.2013.6523628}, researchr = {https://researchr.org/publication/HsuRCK13}, cites = {0}, citedby = {0}, pages = {316-321}, booktitle = {International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013}, publisher = {IEEE}, isbn = {978-1-4673-4951-2}, }