A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature - researchr publication authors

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Jiaxing Hu, Bo Jing, Yifeng Huang, Xiaoxuan Jiao, Meng Sun, Longteng Li. A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature. IEEE Access, 8:122898-122907, 2020. [doi]

This author has not been identified. Look up 'Jiaxing Hu' in GoogleThis author has not been identified. Look up 'Bo Jing' in GoogleThis author has not been identified. Look up 'Yifeng Huang' in GoogleThis author has not been identified. Look up 'Xiaoxuan Jiao' in GoogleThis author has not been identified. Look up 'Meng Sun' in GoogleThis author has not been identified. Look up 'Longteng Li' in Google

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