Jiaxing Hu, Bo Jing, Yifeng Huang, Xiaoxuan Jiao, Meng Sun, Longteng Li. A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature. IEEE Access, 8:122898-122907, 2020. [doi]
@article{HuJHJSL20,
title = {A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature},
author = {Jiaxing Hu and Bo Jing and Yifeng Huang and Xiaoxuan Jiao and Meng Sun and Longteng Li},
year = {2020},
doi = {10.1109/ACCESS.2020.3007365},
url = {https://doi.org/10.1109/ACCESS.2020.3007365},
researchr = {https://researchr.org/publication/HuJHJSL20},
cites = {0},
citedby = {0},
journal = {IEEE Access},
volume = {8},
pages = {122898-122907},
}