A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature

Jiaxing Hu, Bo Jing, Yifeng Huang, Xiaoxuan Jiao, Meng Sun, Longteng Li. A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature. IEEE Access, 8:122898-122907, 2020. [doi]

Abstract

Abstract is missing.