Sai Hu, Qin Wang, Zheng Guo 0001, Jing Xie, Zhigang Mao. Fault detection and redundancy design for TSVs in 3D ICs. In 2015 IEEE 11th International Conference on ASIC, ASICON 2015, Chengdu, China, November 3-6, 2015. pages 1-4, IEEE, 2015. [doi]
Abstract is missing.