Yao-Hung Huang, Yu-Cheng Hsieh, Yu-Cheng Lin, Yue-Der Chih, Eric Wang, Jonathan Chang, Ya-Chin King, Chrong Jung Lin. High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]
Abstract is missing.