Oscillation-Based Prebond TSV Test

Li-Ren Huang, Shi-Yu Huang, Stephen K. Sunter, Kun-Han Tsai, Wu-Tung Cheng. Oscillation-Based Prebond TSV Test. IEEE Trans. on CAD of Integrated Circuits and Systems, 32(9):1440-1444, 2013. [doi]

Authors

Li-Ren Huang

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Shi-Yu Huang

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Stephen K. Sunter

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Kun-Han Tsai

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Wu-Tung Cheng

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