Shi-Yu Huang, Li-Ren Huang, Kun-Han Tsai, Wu-Tung Cheng. Delay testing and characterization of post-bond interposer wires in 2.5-D ICs. In 2013 IEEE International Test Conference, ITC 2013, Anaheim, CA, USA, September 6-13, 2013. pages 1-8, IEEE Computer Society, 2013. [doi]
@inproceedings{HuangHTC13,
title = {Delay testing and characterization of post-bond interposer wires in 2.5-D ICs},
author = {Shi-Yu Huang and Li-Ren Huang and Kun-Han Tsai and Wu-Tung Cheng},
year = {2013},
doi = {10.1109/TEST.2013.6651906},
url = {http://doi.ieeecomputersociety.org/10.1109/TEST.2013.6651906},
researchr = {https://researchr.org/publication/HuangHTC13},
cites = {0},
citedby = {0},
pages = {1-8},
booktitle = {2013 IEEE International Test Conference, ITC 2013, Anaheim, CA, USA, September 6-13, 2013},
publisher = {IEEE Computer Society},
}