Shi-Yu Huang, Li-Ren Huang, Kun-Han Tsai, Wu-Tung Cheng. Delay testing and characterization of post-bond interposer wires in 2.5-D ICs. In 2013 IEEE International Test Conference, ITC 2013, Anaheim, CA, USA, September 6-13, 2013. pages 1-8, IEEE Computer Society, 2013. [doi]
Abstract is missing.