Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs

Li-Ren Huang, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng. Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 33(3):476-488, 2014. [doi]

Authors

Li-Ren Huang

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Shi-Yu Huang

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Kun-Han Tsai

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Wu-Tung Cheng

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