Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Ming Chen, Yan-Yu Huang, Hsiao-Chun Chang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou. An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. In IEEE International Symposium on Circuits and Systems, ISCAS 2016, Montréal, QC, Canada, May 22-25, 2016. pages 1302-1305, IEEE, 2016. [doi]
Abstract is missing.