Yu-Jen Huang, Jin-Fu Li, Che-Wei Chou. Post-bond test techniques for TSVs with crosstalk faults in 3D ICs. In Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, VLSI-DAT 2012, Hsinchu, Taiwan, April 23-25, 2012. pages 1-4, IEEE, 2012. [doi]
Abstract is missing.