Chun-An Huang, Li-Chuang, Kim Hsu, Steel Chung, Tim Chan. A novel physical failure analysis of MEMS motion sensor for interface inspection. In Sixteenth International Symposium on Quality Electronic Design, ISQED 2015, Santa Clara, CA, USA, March 2-4, 2015. pages 561-564, IEEE, 2015. [doi]
Abstract is missing.