Yen-Hsiang Huang, Sai Pentapati, Anthony Agnesina, Moritz Brunion, Sung Kyu Lim. On Legalization of Die Bonding Bumps and Pads for 3-D ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 43(9):2741-2754, September 2024. [doi]
Abstract is missing.